| Age | Commit message (Collapse) | Author |
|---|
|
Reading thermal sensor on mt7986 devices returns invalid temperature:
bpi-r3 ~ # cat /sys/class/thermal/thermal_zone0/temp
-274000
Fix this by adding missing members in mtk_thermal_data struct which were
used in mtk_thermal_turn_on_buffer after commit 33140e668b10.
Cc: stable@vger.kernel.org
Fixes: 33140e668b10 ("thermal/drivers/mediatek: Control buffer enablement tweaks")
Signed-off-by: Frank Wunderlich <frank-w@public-files.de>
Reviewed-by: Markus Schneider-Pargmann <msp@baylibre.com>
Reviewed-by: Daniel Golle <daniel@makrotopia.org>
Tested-by: Daniel Golle <daniel@makrotopia.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230907112018.52811-1-linux@fw-web.de
|
|
Fix the probe function to call mtk_thermal_release_periodic_ts for
everything != MTK_THERMAL_V1. This was accidentally changed from V1
to V2 in the original patch.
Reported-by: Frank Wunderlich <frank-w@public-files.de>
Closes: https://lore.kernel.org/lkml/B0B3775B-B8D1-4284-814F-4F41EC22F532@public-files.de/
Reported-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Closes: https://lore.kernel.org/lkml/07a569b9-e691-64ea-dd65-3b49842af33d@linaro.org/
Fixes: 33140e668b10 ("thermal/drivers/mediatek: Control buffer enablement tweaks")
Signed-off-by: Markus Schneider-Pargmann <msp@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230918100706.1229239-1-msp@baylibre.com
|
|
This function call was found to be unnecessary as there is no equivalent
platform_get_drvdata() call to access the private data of the driver. Also,
the private data is defined in this driver, so there is no risk of it being
accessed outside of this driver file.
Signed-off-by: Andrei Coardos <aboutphysycs@gmail.com>
Reviewed-by: Alexandru Ardelean <alex@shruggie.ro>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230811192847.3838-1-aboutphysycs@gmail.com
|
|
The DT of_device.h and of_platform.h date back to the separate
of_platform_bus_type before it as merged into the regular platform bus.
As part of that merge prepping Arm DT support 13 years ago, they
"temporarily" include each other. They also include platform_device.h
and of.h. As a result, there's a pretty much random mix of those include
files used throughout the tree. In order to detangle these headers and
replace the implicit includes with struct declarations, users need to
explicitly include the correct includes.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
in mtk_thermal_probe"
This reverts commit f05c7b7d9ea9477fcc388476c6f4ade8c66d2d26.
That change was causing a regression in the generic-adc-thermal-probed
bootrr test as reported in the kernelci-results list [1].
A proper rework will take longer, so revert it for now.
[1] https://groups.io/g/kernelci-results/message/42660
Fixes: f05c7b7d9ea9 ("thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe")
Signed-off-by: Ricardo Cañuelo <ricardo.canuelo@collabora.com>
Suggested-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230525121811.3360268-1-ricardo.canuelo@collabora.com
|
|
Replace of_get_address() and of_translate_address() calls with single
call to of_address_to_resource().
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230319163231.226738-1-robh@kernel.org
|
|
in mtk_thermal_probe
Use devm_clk_get_enabled to do automatic resource management.
Meanwhile, remove error handling labels in the probe function and
the whole remove function.
Signed-off-by: Kang Chen <void0red@hust.edu.cn>
Reviewed-by: Dongliang Mu <dzm91@hust.edu.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230419020749.621257-2-void0red@hust.edu.cn
|
|
mtk_thermal_probe
Smatch reports:
1. mtk_thermal_probe() warn: 'apmixed_base' from of_iomap() not released.
2. mtk_thermal_probe() warn: 'auxadc_base' from of_iomap() not released.
The original code forgets to release iomap resource when handling errors,
fix it by switch to devm_of_iomap.
Fixes: 89945047b166 ("thermal: mediatek: Add tsensor support for V2 thermal system")
Signed-off-by: Kang Chen <void0red@hust.edu.cn>
Reviewed-by: Dongliang Mu <dzm91@hust.edu.cn>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230419020749.621257-1-void0red@hust.edu.cn
|
|
The AUXADC thermal v1 allows reading temperature range between -20°C to
150°C and any value out of this range is invalid.
Add new definitions for MT8173_TEMP_{MIN_MAX} and a new small helper
mtk_thermal_temp_is_valid() to check if new readings are in range: if
not, we tell to the API that the reading is invalid by returning
THERMAL_TEMP_INVALID.
It was chosen to introduce the helper function because, even though this
temperature range is realistically ok for all, it comes from a downstream
kernel driver for version 1, but here we also support v2 and v3 which may
may have wider constraints.
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230419061146.22246-3-angelogioacchino.delregno@collabora.com
|
|
Some more testing revealed that this commit introduces a regression on some
MT8173 Chromebooks and at least on one MT6795 Sony Xperia M5 smartphone due
to the delay being apparently variable and machine specific.
Another solution would be to delay for a bit more (~70ms) but this is not
feasible for two reasons: first of all, we're adding an even bigger delay
in a probe function; second, some machines need less, some may need even
more, making the msleep at probe solution highly suboptimal.
This reverts commit 10debf8c2da8011c8009dd4b3f6d0ab85891c81b.
Fixes: 10debf8c2da8 ("thermal/drivers/mediatek: Add delay after thermal banks initialization")
Reported-by: "kernelci.org bot" <bot@kernelci.org>
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230419061146.22246-2-angelogioacchino.delregno@collabora.com
|
|
Thermal sensor reads performed immediately after thermal bank
initialization returns bogus values. This is currently tackled by returning
0 if the temperature is bogus (exceeding 200000).
Instead, add a delay between the bank init and the thermal zone device
register to properly fix this.
Signed-off-by: Michael Kao <michael.kao@mediatek.com>
Signed-off-by: Hsin-Yi Wang <hsinyi@chromium.org>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-5-55a1ae14af74@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
|
|
MT8365 is similar to the other SoCs supported by the driver. It has only
one bank and 3 actual sensors that can be multiplexed. There is another
one sensor that does not have usable data.
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-3-55a1ae14af74@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
|
|
Add logic in order to be able to turn on the control buffer on MT8365.
This change now allows to have control buffer support for MTK_THERMAL_V1,
and it allows to define the register offset, and mask used to enable it.
Signed-off-by: Markus Schneider-Pargmann <msp@baylibre.com>
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-2-55a1ae14af74@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
|
|
The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
zone structure pointer as parameter.
Actually, it uses the tz->device to add it in the devres list.
It is preferable to use the device registering the thermal zone
instead of the thermal zone device itself. That prevents the driver
accessing the thermal zone structure internals and it is from my POV
more correct regarding how devm_ is used.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it, and rename it
as "auxadc_thermal.c" to show its purpose more clearly.
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
