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Just adding its own platform_driver, not really
using it yet.
When all HW glue layers are converted, more patches
will come to split power management code from musb_core
and move it completely to HW glue layer.
Signed-off-by: Felipe Balbi <balbi@ti.com>
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preparing to a big refactor on musb code. We need
to be able to compile in all glue layers (or at
least all ARM-based ones) together and have a
working binary.
While preparing for that, we move every glue
layer to export only one symbol, which is
a struct musb_platform_ops, and make all
other functions static.
Later patches will come to allow for compiling
all glue layers together and have a working
binary.
Signed-off-by: Felipe Balbi <balbi@ti.com>
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Texas Instruments DA8xx/OMAP-L1x glue layer for the
MUSBMHRDC driver.
Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: Yadviga Grigorieva <yadviga@ru.mvista.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
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