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This patch adds support to parse probe data for
dwc3-exynos driver using device tree.
Signed-off-by: Vivek Gautam <gautam.vivek@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
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The lockless implementation of the unique id is quite impressive (:P)
but dirver's core can handle it, we can remove it and make our code a
little smaller.
Cc: Anton Tikhomirov <av.tikhomirov@samsung.com>
Signed-off-by: Sebastian Andrzej Siewior <bigeasy@linutronix.de>
Signed-off-by: Felipe Balbi <balbi@ti.com>
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We will be adding support for transceivers on
dwc3 driver but not all boards have controllable
transceivers.
For those which don't provide controllable transceivers
we will register nop transceivers.
Signed-off-by: Felipe Balbi <balbi@ti.com>
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module.h header file was included twice.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Felipe Balbi <balbi@ti.com>
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Adds Exynos Specific Glue layer to support USB peripherals
on Samsung Exynos5 chips.
[ balbi@ti.com : prevent compilation of Exynos glue layer
on platforms which don't provide clk API implementation ]
Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
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