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The interrupt for the temperature threshold is not enabled at the end of the
probe function, enable it after the setup is complete.
On the other side, the irq_enabled is not correctly set as we are checking if
the interrupt is masked where 'yes' means irq_enabled=false.
irq_get_irqchip_state(data->irq, IRQCHIP_STATE_MASKED,
&data->irq_enabled);
As we are always enabling the interrupt, it is pointless to check if
the interrupt is masked or not, just set irq_enabled to 'true'.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Leo Yan <leo.yan@linaro.org>
Tested-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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on unload
While debugging some PM issues and trying to remove all the loaded modules, I ran
across the following when unloading ti-soc-thermal:
Unable to handle kernel NULL pointer dereference at virtual address 000000b4
...
[<c08db340>] (kobject_put) from [<bf28954c>] (ti_thermal_unregister_cpu_cooling+0x20/0x28 [ti_soc_thermal])
[<bf28954c>] (ti_thermal_unregister_cpu_cooling [ti_soc_thermal]) from [<bf287c88>] (ti_bandgap_remove+0x3c/0x104 [ti_soc_thermal])
[<bf287c88>] (ti_bandgap_remove [ti_soc_thermal]) from [<c0610d48>] (platform_drv_remove+0x24/0x3c)
[<c0610d48>] (platform_drv_remove) from [<c060f114>] (device_release_driver_internal+0x160/0x208)
[<c060f114>] (device_release_driver_internal) from [<c060f200>] (driver_detach+0x38/0x6c)
[<c060f200>] (driver_detach) from [<c060e2d4>] (bus_remove_driver+0x4c/0xa0)
[<c060e2d4>] (bus_remove_driver) from [<c01f2370>] (SyS_delete_module+0x168/0x238)
[<c01f2370>] (SyS_delete_module) from [<c0108240>] (ret_fast_syscall+0x0/0x28)
Cc: Keerthy <j-keerthy@ti.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The initialization sequence for H3 (r8a7795) ES1.x and ES2.0 is
different. H3 ES2.0 and later uses the same sequence as M3 (r8a7796)
ES1.0. Fix this by not looking at compatible strings and instead
defaulting to the r8a7796 initialization sequence and use
soc_device_match() to check for H3 ES1.x.
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The formula implementation at armada_get_temp() indicates that the sign
in the formula is inverted.
Cc: Ezequiel Garcia <ezequiel@vanguardiasur.com.ar>
Signed-off-by: Baruch Siach <baruch@tkos.co.il>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The dev pointer is going through a null check after a dereference.
So this patch removes that useless check since the driver does not
pass a null dev pointer in any case.
Signed-off-by: Nicolin Chen <nicoleotsuka@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Moving the bcm2835 thermal driver to the broadcom directory prevented it
from getting enabled for arm64 builds, since the broadcom directory is only
available when 32-bit specific ARCH_BCM is set.
Fix this by enabling the Broadcom menu for ARCH_BCM or ARCH_BCM2835.
Fixes: 6892cf07e733 ("thermal: bcm2835: move to the broadcom subdirectory")
Reviewed-by: Eric Anholt <eric@anholt.net>
Signed-off-by: Allen Wild <allenwild93@gmail.com>
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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RV1108 SOC has one Temperature Sensor for CPU.
Reviewed-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Rocky Hao <rocky.hao@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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On Tegra186, the BPMP (Boot and Power Management Processor) exposes an
interface to thermal sensors on the system-on-chip. This driver
implements access to the interface. It supports reading the
temperature, setting trip points and receiving notification of a
tripped trip point.
Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
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The driver now fails to link into vmlinux when CONFIG_NVMEM is a loadable
module:
drivers/thermal/imx_thermal.o: In function `imx_thermal_probe':
imx_thermal.c:(.text+0x360): undefined reference to `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x360): relocation truncated to fit: R_AARCH64_CALL26 against undefined symbol `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x388): undefined reference to `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x388): relocation truncated to fit: R_AARCH64_CALL26 against undefined symbol `nvmem_cell_read_u32'
This adds a Kconfig dependency to force it to be a module as well
when its dependency is loadable.
Fixes: 7fe5ba04fcdc ("thermal: imx: Add support for reading OCOTP through nvmem")
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Leonard Crestez <leonard.crestez@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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pr_err()/pr_info() messages should end with a new-line to avoid
other messages being concatenated.
Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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On newer imx SOCs accessing OCOTP directly is wrong because the ocotp
clock needs to be enabled first. Add support for reading those same
values through the nvmem API instead.
The older path is preserved for compatibility with older dts and because
it works correctly on imx6qdl chips.
Signed-off-by: Leonard Crestez <leonard.crestez@nxp.com>
Acked-by: Shawn Guo <shawnguo@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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'const-thermal-zone-structure' into next
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into thermal-soc
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there are three concepts represent backlight in int3406_thermal driver.
1. the raw brightness value from native graphics driver.
2. the percentage numbers from ACPI _BCL control method.
3. the consecutive numbers represent cooling states.
int3406_thermal driver
1. uses value from DDDL/DDPC as the lower/upper limit, which is consistent
with ACPI _BCL control methods.
2. reads current and maximum brightness from the native graphics driver.
3. expose them to thermal sysfs I/F
This patch fixes the code that switches between the raw brightness value
and the cooling state, which results in bogus value in thermal sysfs I/F.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Move independent thermal module reset in the beginning.
Signed-off-by: Louis Yu <louis.yu@mediatek.com>
Reviewed-by: Dawei Chien <dawei.chien@mediatek.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch adds support for mt2712 chip thermal calibration data
and calculation, and is compatible with the existing chips.
Signed-off-by: Louis Yu <louis.yu@mediatek.com>
Reviewed-by: Dawei Chien <dawei.chien@mediatek.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch adds support for mt2712 chip to mtk_thermal,
and integrate mt2712 into the same mediatek thermal driver.
MT2712 has only 1 bank and 4 sensors.
Signed-off-by: Louis Yu <louis.yu@mediatek.com>
Reviewed-by: Dawei Chien <dawei.chien@mediatek.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Using the TSDSS flag to determine whether the thermal sensor is
enabled is problematic. Broadwell-DE (Xeon D-1500) does not support
dynamic shutdown and the TSDSS flag always reads 0 (contrary to the
current datasheet). Even on hardware supporting dynamic shutdown, the
driver does nothing to configure it, and the dynamic shutdown state
should not prevent the driver from loading. The ETS flag itself
indicates whether the thermal sensor is enabled, so use it instead of
the TSDSS flag on all hardware platforms.
Signed-off-by: Ed Swierk <eswierk@skyportsystems.com>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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RK3328 SOC has one Temperature Sensor for CPU.
Signed-off-by: Rocky Hao <rocky.hao@rock-chips.com>
Reviewed-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The thermal_zone_of_device_ops structure is only passed as the fourth
argument to thermal_zone_of_sensor_register, which is declared as const.
Thus the thermal_zone_of_device_ops structure itself can be const.
Done with the help of Coccinelle.
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Acked-by: Stefan Wahren <stefan.wahren@i2se.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The thermal_zone_of_device_ops structure is only passed as the fourth
argument to thermal_zone_of_sensor_register, which is declared as const.
Thus the thermal_zone_of_device_ops structure itself can be const.
Done with the help of Coccinelle.
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The thermal_zone_of_device_ops structure is only passed as the fourth
argument to thermal_zone_of_sensor_register, which is declared as const.
Thus the thermal_zone_of_device_ops structure itself can be const.
Done with the help of Coccinelle.
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The thermal_zone_of_device_ops structure is only passed as the fourth
argument to devm_thermal_zone_of_sensor_register, which is declared
as const. Thus the thermal_zone_of_device_ops structure itself can
be const.
Done with the help of Coccinelle.
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The thermal_zone_of_device_ops structure is only passed as the fourth
argument to thermal_zone_of_sensor_register, which is declared as const.
Thus the thermal_zone_of_device_ops structure itself can be const.
Done with the help of Coccinelle.
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The thermal_zone_of_device_ops structure is only passed as the fourth
argument to devm_thermal_zone_of_sensor_register, which is declared
as const. Thus the thermal_zone_of_device_ops structure itself can
be const.
Done with the help of Coccinelle.
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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thermal_zone_device_register()
Reorder error handling code in order to fix some resources leaks in some
cases:
- 'tz' would leak if 'thermal_zone_create_device_groups()' fails
- memory allocated by 'thermal_zone_create_device_groups()' would leak
if 'device_register()' fails
With this patch, we now have 2 error handling paths: one before
'device_register()', and one after it.
This is needed because some resources are released in 'thermal_release()'.
Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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function
Simplify code by using the new 'thermal_zone_destroy_device_groups()'
helper function.
Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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In order to easily free resources allocated by
'thermal_zone_create_device_groups()' we need 2 new helper functions.
The first one undoes 'thermal_zone_create_device_groups()'.
The 2nd one undoes 'create_trip_attrs()', which is a function called by
'thermal_zone_create_device_groups()'.
Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Some BIOS implement ACPI notification code 0x83 to indicate active
relationship table(ART) and/or thermal relationship table(TRT) changes
to INT3400 device. This event needs to be propagated to user space so
that it can be handled by the user space thermal daemon.
Signed-off-by: Brian Bian <brian.bian@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Add a thermal driver for on-chip PVT (Process, Voltage and Temperature)
monitoring unit implemented on UniPhier SoCs. This driver supports
temperature monitoring and alert function.
Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch fix the few typos in trt structure. Also, update
kernel warn message for failed to get device name from acpi
handle.
Signed-off-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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pci_device_id are not supposed to change at runtime. All functions
working with pci_device_id provided by <linux/pci.h> work with
const pci_device_id. So mark the non-const structs as const.
Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The critical shutdown notice string used to have some spaces missing,
which makes it not so pretty.
Add the spaces to satisfy usual English space rules.
Reported-by: Mingcong Bai <jeffbai@aosc.io>
Signed-off-by: Icenowy Zheng <icenowy@aosc.io>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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We get a Kconfig warning when selecting this without also enabling
CONFIG_PCI:
warning: (X86_INTEL_LPSS && INTEL_SOC_DTS_IOSF_CORE
&& SND_SST_IPC_ACPI && MMC_SDHCI_ACPI && PUNIT_ATOM_DEBUG)
selects IOSF_MBI which has unmet direct dependencies (PCI)
This adds a new depedency.
Fixes: 3a2419f865a6 ("Thermal: Intel SoC: DTS thermal use common APIs")
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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On all supported platforms, the TS Reading (TSR) field in the
Temperature (TEMP) register is 9 bits wide. Values above 0x100 (78
degrees C) are plausible, so don't mask out the topmost bit. And the
register itself is 16 bits wide, so use readw() rather than readl().
Signed-off-by: Ed Swierk <eswierk@skyportsystems.com>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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attribute_groups are not supposed to change at runtime. All functions
working with attribute_groups provided by <linux/sysfs.h> work
with const attribute_group. So mark the non-const structs as const.
File size before:
text data bss dec hex filename
3152 1096 8 4256 10a0 processor_thermal_device.o
File size After adding 'const':
text data bss dec hex filename
3216 1032 8 4256 10a0 processor_thermal_device.o
Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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attribute_groups are not supposed to change at runtime. All functions
working with attribute_groups provided by <linux/sysfs.h> work
with const attribute_group. So mark the non-const structs as const.
File size before:
text data bss dec hex filename
1687 592 0 2279 8e7 int3400_thermal.o
File size After adding 'const':
text data bss dec hex filename
1751 528 0 2279 8e7 int3400_thermal.o
Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
- Improve thermal cpu_cooling interaction with cpufreq core.
The cpu_cooling driver is designed to use CPU frequency scaling to
avoid high thermal states for a platform. But it wasn't glued really
well with cpufreq core.
For example clipped-cpus is copied from the policy structure and its
much better to use the policy->cpus (or related_cpus) fields directly
as they may have got updated. Not that things were broken before this
series, but they can be optimized a bit more.
This series tries to improve interactions between cpufreq core and
cpu_cooling driver and does some fixes/cleanups to the cpu_cooling
driver. (Viresh Kumar)
- A couple of fixes and cleanups in thermal core and imx, hisilicon,
bcm_2835, int340x thermal drivers. (Arvind Yadav, Dan Carpenter,
Sumeet Pawnikar, Srinivas Pandruvada, Willy WOLFF)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (24 commits)
thermal: bcm2835: fix an error code in probe()
thermal: hisilicon: Handle return value of clk_prepare_enable
thermal: imx: Handle return value of clk_prepare_enable
thermal: int340x: check for sensor when PTYP is missing
Thermal/int340x: Fix few typos and kernel-doc style
thermal: fix source code documentation for parameters
thermal: cpu_cooling: Replace kmalloc with kmalloc_array
thermal: cpu_cooling: Rearrange struct cpufreq_cooling_device
thermal: cpu_cooling: 'freq' can't be zero in cpufreq_state2power()
thermal: cpu_cooling: don't store cpu_dev in cpufreq_cdev
thermal: cpu_cooling: get_level() can't fail
thermal: cpu_cooling: create structure for idle time stats
thermal: cpu_cooling: merge frequency and power tables
thermal: cpu_cooling: get rid of 'allowed_cpus'
thermal: cpu_cooling: OPPs are registered for all CPUs
thermal: cpu_cooling: store cpufreq policy
cpufreq: create cpufreq_table_count_valid_entries()
thermal: cpu_cooling: use cpufreq_policy to register cooling device
thermal: cpu_cooling: get rid of a variable in cpufreq_set_cur_state()
thermal: cpu_cooling: remove cpufreq_cooling_get_level()
...
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git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd
Pull MFD updates from Lee Jones:
"New Drivers:
- Intel Cherry Trail Whiskey Cove PMIC
- TI LP87565 PMIC
New Device Support:
- Add support for Cannonlake to intel-lpss-pci
- Add support for Simatic IOT2000 to intel_quark_i2c_gpio
New Functionality:
- Add Regulator support (axp20x)
Fix-ups:
- Rework IRQ handling (intel_soc_pmic_bxtwc, rtsx_pcr, cros_ec)
- Remove unused/unwelcome code (ipaq-micro, wm831x-core, da9062-core)
- Provide deregistration on unbind (rn5t618)
- Rework DT code/documentation (arizona)
- Constify things (fsl-imx25-tsadc)
- MAINTAINERS updates (DA9062/61)
- Kconfig configuration adaptions (INTEL_SOC_PMIC, MFD_AXP20X_I2C)
- Switch to DMI matching (intel_quark_i2c_gpio)
- Provide an appropriate level of error checking (wm831x-{i2c,spi},
twl4030-irq, tc6393xb)
- Make use of devm_* (resource handling) calls (intel_soc_pmic_bxtwc,
stm32-timers, atmel-flexcom, cros_ec, fsl-imx25-tsadc,
exynos-lpass, palmas, qcom-spmi-pmic, smsc-ece1099,
motorola-cpcap)"
[ Skipped the last commit in that series that added eight thousand
lines of pointless repeated register definitions. - Linus ]
* tag 'mfd-next-4.13' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd: (38 commits)
mfd: Add LP87565 PMIC support
mfd: cros_ec: Free IRQ on exit
dt-bindings: vendor-prefixes: Add arctic to vendor prefix
mfd: da9061: Fix to remove BBAT_CONT register from chip model
mfd: da9061: Fix to remove BBAT_CONT register from chip model
mfd: axp20x-i2c: Document that this must be builtin on x86
mfd: Add Cherry Trail Whiskey Cove PMIC driver
mfd: tc6393xb: Handle return value of clk_prepare_enable
mfd: intel_quark_i2c_gpio: Add support for SIMATIC IOT2000 platform
mfd: intel_quark_i2c_gpio: Use dmi_system_id table for retrieving frequency
mfd: motorola-cpcap: Use devm_of_platform_populate()
mfd: smsc-ece: Use devm_of_platform_populate()
mfd: qcom-spmi-pmic: Use devm_of_platform_populate()
mfd: palmas: Use devm_of_platform_populate()
mfd: exynos: Use devm_of_platform_populate()
mfd: fsl-imx25: Use devm_of_platform_populate()
mfd: cros_ec: Use devm_of_platform_populate()
mfd: atmel: Use devm_of_platform_populate()
mfd: stm32-timers: Use devm_of_platform_populate()
mfd: intel_soc_pmic: Select designware i2c-bus driver
...
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git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
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git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/usb
Pull USB/PHY updates from Greg KH:
"Here is the big patchset of USB and PHY driver updates for 4.13-rc1.
On the PHY side, they decided to move files around to "make things
easier" in their tree. Hopefully that wasn't a mistake, but in
linux-next testing, we haven't had any reported problems.
There's the usual set of gadget and xhci and musb updates in here as
well, along with a number of smaller updates for a raft of different
USB drivers. Full details in the shortlog, nothing really major.
All of these have been in linux-next for a while with no reported
issues"
* tag 'usb-4.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/usb: (173 commits)
Add USB quirk for HVR-950q to avoid intermittent device resets
USB hub_probe: rework ugly goto-into-compound-statement
usb: host: ohci-pxa27x: Handle return value of clk_prepare_enable
USB: serial: cp210x: add ID for CEL EM3588 USB ZigBee stick
usbip: Fix uninitialized variable bug in vhci
usb: core: read USB ports from DT in the usbport LED trigger driver
dt-bindings: leds: document new trigger-sources property
usb: typec: ucsi: Add ACPI driver
usb: typec: Add support for UCSI interface
usb: musb: compress return logic into one line
USB: serial: propagate late probe errors
USB: serial: refactor port endpoint setup
usb: musb: tusb6010_omap: Convert to DMAengine API
ARM: OMAP2+: DMA: Add slave map entries for 24xx external request lines
usb: musb: tusb6010: Handle DMA TX completion in DMA callback as well
usb: musb: tusb6010_omap: Allocate DMA channels upfront
usb: musb: tusb6010_omap: Create new struct for DMA data/parameters
usb: musb: tusb6010_omap: Use one musb_ep_select call in tusb_omap_dma_program
usb: musb: tusb6010: Add MUSB_G_NO_SKB_RESERVE to quirks
usb: musb: Add quirk to avoid skb reserve in gadget mode
...
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This causes a static checker because we're passing a valid pointer to
PTR_ERR(). "err" is already the correct error code, so we can just
delete this line.
Fixes: bcb7dd9ef206 ("thermal: bcm2835: add thermal driver for bcm2835 SoC")
Acked-by: Stefan Wahren <stefan.wahren@i2se.com>
Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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clk_prepare_enable() can fail here and we must check its return value.
Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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clk_prepare_enable() can fail here and we must check its return value.
Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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For INT3403 sensor PTYP field is mandatory. But some platforms didn't
have this field for sensors. This cause load failure for int3403 driver.
This change checks for the presence of _TMP method and if present, then
treats this device as a sensor.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch fix the few typos in function header of
acpi_parse_trt. Also, fix the typo in kernel debug
message for acpi_parse_art.
Signed-off-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Some parameters are not documented, or not present at all, in thermal
governors code.
Signed-off-by: Willy Wolff <willy.mh.wolff@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Since all second level thermal IRQs are consumed by the same
device(bxt_wcove_thermal), there is no need to expose them as separate
interrupts. We can just export only the first level IRQs for thermal and
let the device(bxt_wcove_thermal) driver handle the second level IRQs
based on thermal interrupt status register. Also, just using only the
first level IRQ will eliminate the bug involved in requesting only the
second level IRQ and not explicitly enable the first level IRQ. For
more info on this issue please read the details at,
https://lkml.org/lkml/2017/2/27/148
This patch also makes relevant change in bxt_wcove_thermal driver to use
only first level PMIC thermal IRQ.
Signed-off-by: Kuppuswamy Sathyanarayanan <sathyanarayanan.kuppuswamy@linux.intel.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Andy Shevchenko <andy.shevchenko@gmail.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
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Use the new helper for reusing a device-tree node of another device
instead of managing the node references explicitly.
This also makes sure that the new of_node_reuse flag is set if the
device is ever reprobed, something which specifically now avoids driver
core from attempting to claim any pinmux resources already claimed by
the parent device.
Fixes: ec4664b3fd6d ("thermal: max77620: Add thermal driver for reporting junction temp")
Cc: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Johan Hovold <johan@kernel.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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