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It is generally inefficient to iterate over trip indices and call
thermal_zone_get_trip() every time to get the struct thermal_trip
corresponding to the given trip index, so modify the Tegra thermal
drivers to use thermal_zone_for_each_trip() for walking trips.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://patch.msgid.link/1819430.VLH7GnMWUR@rjwysocki.net
[ rjw: Dropped an unused local variable ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Introduce a helper structure, struct trip_temps, for storing the
temperatures of the critical and hot trip points.
This helps to make the code in tegra_tsensor_get_hw_channel_trips()
somewhat cleaner and will be useful subsequently in eliminating
iteration over trip indices from the driver.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://patch.msgid.link/9333090.CDJkKcVGEf@rjwysocki.net
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The DT of_device.h and of_platform.h date back to the separate
of_platform_bus_type before it as merged into the regular platform bus.
As part of that merge prepping Arm DT support 13 years ago, they
"temporarily" include each other. They also include platform_device.h
and of.h. As a result, there's a pretty much random mix of those include
files used throughout the tree. In order to detangle these headers and
replace the implicit includes with struct declarations, users need to
explicitly include the correct includes.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.
Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-6-frank.li@vivo.com
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The function tegra_tsensor_enable_hw_channel() takes the thermal zone
lock to prevent "a potential" race with a call to set_trips()
callback.
The driver must not play with the thermal framework core code
internals.
The tegra_tsensor_enable_hw_channel() is called by:
- the suspend / resume callbacks
- the probe function after the thermal zones are registered
The thermal zone lock taken in this function is supposed to protect
from a call to the set_trips() callback which writes in the same
register.
The potential race is when suspend / resume are called at the same
time as set_trips. This one is called only in
thermal_zone_device_update().
- At suspend time, the 'in_suspend' is set, thus the
thermal_zone_device_update() bails out immediately and set_trips is
not called during this moment.
- At resume time, the thermal zone is updated at PM_POST_SUSPEND,
thus the driver has already set the TH2 temperature.
- At probe time, we register the thermal zone and then we set the
TH2. The only scenario I can see so far is the interrupt fires, the
thermal_zone_update() is called exactly at the moment
tegra_tsensor_enable_hw_channel() a few lines after registering it.
Enable the channels before setting up the interrupt. We close the
potential race window without using the thermal zone's lock.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Suggested-by: Thierry Reding <thierry.reding@gmail.com>
Acked-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
zone structure pointer as parameter.
Actually, it uses the tz->device to add it in the devres list.
It is preferable to use the device registering the thermal zone
instead of the thermal zone device itself. That prevents the driver
accessing the thermal zone structure internals and it is from my POV
more correct regarding how devm_ is used.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.
Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.
Remove this inclusion in every place where it is possible.
Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.
The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.
The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Replace a single call to thermal_zone_get_trip() to get a trip point
instead of calling the different ops->get_trip*
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20221003092602.1323944-11-daniel.lezcano@linaro.org
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The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.
Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-8-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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In order to use thermal trips defined in the thermal structure, rename
the 'trips' field to 'num_trips' to have the 'trips' field containing the
thermal trip points.
Cc: Alexandre Bailon <abailon@baylibre.com>
Cc: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220722200007.1839356-8-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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All NVIDIA Tegra30 SoCs have a two-channel on-chip sensor unit which
monitors temperature and voltage of the SoC. Sensors control CPU frequency
throttling, which is activated by hardware once preprogrammed temperature
level is breached, they also send signal to Power Management controller to
perform emergency shutdown on a critical overheat of the SoC die. Add
driver for the Tegra30 TSENSOR module, exposing it as a thermal sensor.
Tested-by: Andreas Westman Dorcsak <hedmoo@yahoo.com> # Asus TF700T
Tested-by: Maxim Schwalm <maxim.schwalm@gmail.com> # Asus TF700T
Tested-by: Svyatoslav Ryhel <clamor95@gmail.com> # Asus TF201T
Tested-by: Ihor Didenko <tailormoon@rambler.ru> # Asus TF300T
Tested-by: Ion Agorria <ion@agorria.com> # Asus TF201T
Tested-by: Matt Merhar <mattmerhar@protonmail.com> # Ouya
Tested-by: Peter Geis <pgwipeout@gmail.com> # Ouya
Acked-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Dmitry Osipenko <digetx@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210616190417.32214-4-digetx@gmail.com
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