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commit fee9b240916df82a8b07aef0fdfe96785417a164 upstream.
These four chips:
* W25N512GW
* W25N01GW
* W25N01JW
* W25N02JW
all require a single bit of ECC strength and thus feature an on-die
Hamming-like ECC engine. There is no point in filling a ->get_status()
callback for them because the main ECC status bytes are located in
standard places, and retrieving the number of bitflips in case of
corrected chunk is both useless and unsupported (if there are bitflips,
then there is 1 at most, so no need to query the chip for that).
Without this change, a kernel warning triggers every time a bit flips.
Fixes: 6a804fb72de5 ("mtd: spinand: winbond: add support for serial NAND flash")
Cc: stable@vger.kernel.org
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de>
Link: https://lore.kernel.org/linux-mtd/20241009125002.191109-3-miquel.raynal@bootlin.com
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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commit c1247de51cab53fc357a73804c11fb4fba55b2d9 upstream.
Both W25N512GW and W25N02JW chips have 64 bytes of OOB and thus cannot
use the layout for 128 bytes OOB. Reference the correct layout instead.
Fixes: 6a804fb72de5 ("mtd: spinand: winbond: add support for serial NAND flash")
Cc: stable@vger.kernel.org
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de>
Link: https://lore.kernel.org/linux-mtd/20241009125002.191109-2-miquel.raynal@bootlin.com
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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Add support for Winbond W25N01KV 1Gbit SPI-NAND.
It has 4-bit on-die ECC.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/linux-mtd/20240805175125.6658-1-robimarko@gmail.com
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Add support for W25N04KV.
W25N04KV has 8-bit on-die ECC.
Signed-off-by: Zhi-Jun You <hujy652@gmail.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/linux-mtd/20240107144120.532-1-hujy652@gmail.com
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Add support for W25N01JW, W25N02JWZEIF, W25N512GW,
W25N02KWZEIR and W25N01GWZEIG.
W25N02KWZEIR has 8b/512b on-die ECC capability and other
four has 4b/512b on-die ECC capability.
Signed-off-by: Sridharan S N <quic_sridsn@quicinc.com>
Signed-off-by: Md Sadre Alam <quic_mdalam@quicinc.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/linux-mtd/20231012064134.4068621-1-quic_sridsn@quicinc.com
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Reading ECC status is failing.
w25n02kv_ecc_get_status() is using on-stack buffer for
SPINAND_GET_FEATURE_OP() output. It is not suitable for
DMA needs of spi-mem.
Fix this by using the spi-mem operations dedicated buffer
spinand->scratchbuf.
See
spinand->scratchbuf:
https://git.kernel.org/pub/scm/linux/kernel/git/torvalds/linux.git/tree/include/linux/mtd/spinand.h?h=v6.3#n418
spi_mem_check_op():
https://git.kernel.org/pub/scm/linux/kernel/git/torvalds/linux.git/tree/drivers/spi/spi-mem.c?h=v6.3#n199
Fixes: 6154c7a58348 ("mtd: spinand: winbond: add Winbond W25N02KV flash support")
Cc: stable@vger.kernel.org
Signed-off-by: Olivier Maignial <olivier.maignial@hotmail.fr>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/linux-mtd/DB4P250MB1032EDB9E36B764A33769039FE23A@DB4P250MB1032.EURP250.PROD.OUTLOOK.COM
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Add support of Winbond W25N02KV flash
Signed-off-by: Mikhail Kshevetskiy <mikhail.kshevetskiy@iopsys.eu>
Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/linux-mtd/20221010105110.446674-2-mikhail.kshevetskiy@iopsys.eu
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Winbond uses 3 bytes to identify flash: vendor_id, dev_id_0, dev_id_1,
but current driver uses only first 2 bytes of it for devices
identification. As result Winbond W25N02KV flash (id_bytes: EF, AA, 22)
is identified as W25N01GV (id_bytes: EF, AA, 21).
Fix this by adding missed identification bytes.
Signed-off-by: Mikhail Kshevetskiy <mikhail.kshevetskiy@iopsys.eu>
Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/linux-mtd/20221010105110.446674-1-mikhail.kshevetskiy@iopsys.eu
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Currently there are 3 different variants of read_id implementation:
1. opcode only. Found in GD5FxGQ4xF.
2. opcode + 1 addr byte. Found in GD5GxGQ4xA/E
3. opcode + 1 dummy byte. Found in other currently supported chips.
Original implementation was for variant 1 and let detect function
of chips with variant 2 and 3 to ignore the first byte. This isn't
robust:
1. For chips of variant 2, if SPI master doesn't keep MOSI low
during read, chip will get a random id offset, and the entire id
buffer will shift by that offset, causing detect failure.
2. For chips of variant 1, if it happens to get a devid that equals
to manufacture id of variant 2 or 3 chips, it'll get incorrectly
detected.
This patch reworks detect procedure to address problems above. New
logic do detection for all variants separatedly, in 1-2-3 order.
Since all current detect methods do exactly the same id matching
procedure, unify them into core.c and remove detect method from
manufacture_ops.
Tested on GD5F1GQ4UAYIG and W25N01GVZEIG.
Signed-off-by: Chuanhong Guo <gch981213@gmail.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/linux-mtd/20200208074439.146296-1-gch981213@gmail.com
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NAND datasheets usually give the maximum number of bad blocks per LUN
and this number can be used to help upper layers decide how much blocks
they should reserve for bad block handling.
Add a max_bad_eraseblocks_per_lun to the nand_memory_organization
struct and update the NAND_MEMORG() macro (and its users) accordingly.
We also provide a default mtd->_max_bad_blocks() implementation.
Signed-off-by: Boris Brezillon <bbrezillon@kernel.org>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de>
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W25N01GV is a single die version of the already supported
W25M02GV with half the capacity. Everything else is the
same so introduce support for W25N01GV.
Datasheet:http://www.winbond.com/resource-files/w25n01gv%20revl%20050918%20unsecured.pdf
Tested on 8devices Jalapeno dev board under OpenWrt running 4.19-rc5.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Boris Brezillon <boris.brezillon@bootlin.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
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Add support for the W25M02GV chip.
Signed-off-by: Frieder Schrempf <frieder.schrempf@exceet.de>
Signed-off-by: Boris Brezillon <boris.brezillon@bootlin.com>
Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
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